
Abrasives Powder
Hyperion Materials & Technologies manufactures a full line of diamond and cubic boron nitride (cBN) mesh and powders for all of your abrasives needs. Hyperion's synthetic diamonds exhibit unrivaled hardness, excellent abrasion resistance, and low coefficients of friction.
Hyperion's Borazon™ cBN is recognized as one of the greatest technological advancements for grinding hardened ferrous and superalloy materials and is second in hardness to diamond with twice the hardness and four times the abrasion resistance of conventional abrasives. Our extensive materials knowledge gives us the unique ability to partner with you in the development of effective abrasive solutions.
Product Groups
Resources & Tech Notes

Hyperion Code: Borazon 700/300/500/570
Grading: Mesh/FEPA
Description: CBN crystals tailored for electroplating and other single layer systems.

Hyperion Code: Borazon 550(Ti)/510
Grading: Mesh/FEPA
Description: CBN crystals tailored for metal bond systems. Both uncoated and coated crystals are available.
Hyperion Code: Borazon 560/520/420/415/1200/Type II & III/SP2S
Grading: Mesh/FEPA
Description: CBN crystals tailored for resin bond systems. All crystals in this category are coated to achive high performance and stable attrition.
Hyperion Code: Borazon VBR/400/1000/Type I/SPS1
Grading: Mesh/FEPA
Description: CBN crystals tailored for vitrified bond systems. Both uncoated and coated crystals are available.

Hyperion code: cBN G3/GPR7
Grading: Mesh/FEPA
Description: CBN crystals combined with electroplated bonds maintain high cutting and grinding manufacturing performance with excellent accuracy and efficiency. Therefore, it is often used for grinding wheels and on tools of ferrous materials.

Hyperion code: cBN M6
Grading: Mesh/FEPA
Description: CBN crystals combined with metal bonds maintain a long useful tool life with a reduction in the frequency of dressing. It is often used for grinding wheels and on tools of ferrous materials, carbide, ceramics, and quartz.

Hyperion code: cBN R2/R82/G3/K8
Grading: Mesh/FEPA
Description: CBN crystals combined with resin bonds enhance the tool’s performance on the material. It is often used for grinding wheels and on tools of ferrous materials, carbide, ceramics, and quartz.

Hyperion code: cBN K8/M6
Grading: Mesh/FEPA
Description: CBN crystals combined with vitrified bonds to create a glassy or “glass bond” material best suited for rough grinding, semi-finish grinding, finish grinding, polishing, molding, and edge preparation.

Hyperion Code: BMP I/400/500
Description: Uncoated microcrystalline CBN powders used extensively in fine grinding and as PCBN feedstocks.
Hyperion Code: BMP II/TI/400N/550Ti
Description: Coated microcrystalline CBN powders with exceptional thermal conductivity that provides improved surface integrity in the grinding of hardened alloy steels, tool steels, and nickel- and cobalt-based superalloys.
Description: Cubic boron nitride microcrystalline powders create exceptional thermal stability, self-sharpening, and grinding efficiency performance. It is used for lapping, honing, and polishing ferrous materials in automotive, aerospace, and scientific instruments.

Hyperion Series: MBH 95/10
Number of products: 13
Description: Blended to meet toolmakers’ specific performance requirements for creating high-volume tooling across non-ferrous grinding material applications.

Hyperion Series: MBG 680/300
Number of products: 7
Description: Metal bond grinding diamond abrasives are tightly specified products designed for grinding wheels and workpieces to create high-quality tools for demanding non-ferrous workpiece applications with exceptional performance and consistency.

Hyperion Series: MBE
Number of products: 6
Description: Tailored mesh synthetic diamonds designed specifically for electronics applications.
Type: Metal Bond Synthetic Mesh Diamonds
Description: MBS diamond abrasives with tightly controlled shapes and parameters provide precision superabrasives that create highly specialized tooling with ultimate consistency, uniquely tailored to application requirements.

Type: Synthetic mesh diamond powder
Description: PDS Diamond Abrasives are a versatile, multi-purpose superabrasive utilized in grinding, polishing and lapping workpieces to create high-performance tools for a wide variety of applications.

Hyperion Series: RVG
Product Type: Resin and Vitrified Bond Diamonds
Description: Engineered to provide optimum performance in all bond systems, from phenolic resin to high-temperature polyimide resin and vitrified bonds. RVG diamond abrasives grind challenging materials such as tungsten carbides, glass, technical ceramics, and electronic components.

Hyperion Series: PDS/MBH/RB
Number of Products: 3
Description: Synthetic monocrystalline mesh sized diamonds built with a blend of raw materials stringently tested to ensure controlled parameters in particle sizes best suited for grinding, lapping, honing, sawing, and polishing applications.

Hyperion Code: MBM
Description: Premium micron synthetic diamond powder designed for metal bond systems. Designed for exceptional performance when slicing and dicing during processing of silicon wafers, including lapping of glass and ceramics.

Hyperion Code: SJK-5
Description: Standard grade micron synthetic diamond powder designed for metal bond systems. Designed for reliable and secure performance in polishing applications and lapping of glass, wafers, and polycrystalline diamond.

Hyperion Code: GMM
Description: Economy grade micron synthetic diamond powder designed for metal bond systems. Designed for dependable performance in gem polishing and precision wire saws applications.
Hyperion Code: RVM
Description: Premium micron synthetic diamond powder designed for resin bond systems. Designed for exceptional performance when slicing and dicing during processing of silicon wafers, including lapping of glass and ceramics.

Hyperion Code: RJK-1
Description: Standard grade micron synthetic diamond powder designed for resin bond systems. Designed for reliable and secure performance in polishing applications and lapping of glass, wafers, and polycrystalline diamond.

Hyperion Code: GRM
Description: Economy grade micron synthetic diamond powder designed for resin bond systems. Designed for dependable performance in gem polishing and precision wire saws applications.
Hyperion Series: SynMic 1/2/4/6/8S/RBH
Number of Products: 6
Description: Full-line series of synthetic monocrystalline micron diamonds designed for lapping and polishing applications for nonferrous metals, ceramics, and natural and artificial stones.

Description: The detonation process manufactures polycrystalline micron diamond powders and uniquely improves surface finish with no sub-surface damage. Available in size range of 0-0.2 to 6-12 microns.

Type: Micron and sub-micron synthetic diamond powder
Description: Hyperion Diamond powder is a patented unique diamond with a modified surface containing many fine micro-points that drastically reduce the surface roughness of the workpiece.

Type: Micron and sub-micron synthetic diamond powder
Description: A micron-sized diamond solution featuring a uniform blocky shape with high aspect ratios, PSM effectively processes silicon carbide and other hard semiconductor substrates to provide the precision and consistency required to manufacture wafer materials used throughout the electronics industry.

Hyperion Code: UPM
Description: Synthetic ultra premium micron diamond powder is designed for processes where a precise size range and consistency are key. Designed for exceptional performance when back-grinding, dicing, and other precision machining of silicon and semiconductor wafers.
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